LIQUID DAMAGE TREATMENT
Liquid exposure triggers aggressive, immediate electrochemical corrosion across active trace paths. Powering on a fluid-impacted system accelerates this destruction, leading to widespread component carbonization.
1. ULTRASONIC DECONTAMINATION
The logic board is stripped completely of shielding layers and submerged into a specialized chemical ultrasonic bath. High-frequency sound waves create micro-cavitation bubbles that lift microscopic mineral deposits and corrosion scale out from beneath structural BGA chips.
2. CORROSION TRACE ANALYSIS
Once dry, the circuit array is mapped under an optical lens to assess structural trace integrity. Areas showing severe green copper-oxide scaling are isolated for manual trace scraping to expose raw, uncompromised conductive paths.
3. LINE REBUILDING PARAMETERS
Corroded pad configurations are chemically treated, re-tinned with fresh solder matrix, and structurally fortified using UV-curable solder mask insulation. Destroyed resistors and circuit links are completely replaced with clean laboratory assets.